Unisem Chengdu, China
Regional Operation & Production (since 2006)
As a cornerstone of the Unisem Group, Unisem Chengdu Co., Ltd. operates a 520,000-square-foot advanced semiconductor assembly and test facility in Chengdu, China, strategically positioned to serve high-growth markets across Asia and beyond. Since launching mass production in 2006, we’ve cultivated a workforce of 3000+ experts and pioneered cutting-edge manufacturing processes.
With a dedicated 48m² expansion site for Phase 3 development, we are primed to amplify capacity, drive innovation, and deliver scalable solutions for tomorrow’s semiconductor demands.
Regional Comprehensive Solutions
Unisem Chengdu is your trusted partner for full turnkey semiconductor solutions, integrating advanced technologies with agile execution to accelerate time-to-market and optimize supply chains. The facility offers bumping services focused on 200mm wafers.
Seamless Integration
Customized drop-shipping to meet stringent JIT (Just-in-Time) requirements.
Advanced
Packaging & Testing
Diverse Portfolio
Leadframe/substrate packages (QFP, QFN), leadless modules, MEMS, flip-chip, and wafer-level CSP.
Precision testing for analog, mixed-signal, RF, and automotive-grade semiconductors.
200mm wafer bumping (copper pillar, solder bumps), pad redistribution, and re-passivation.
Quality Management System
Unisem’s management system is in compliance to the international and local standards on Quality Management Systems and Environmental Management Systems which are vital to our business globally. Each of Unisem sites is proud to have achieved the third party certification to these standards.