IECQ QC 080000:2017 HSPM Certified Silver GreenRE Certification

Phase 1
- Complete of building construction

Phase 1
Construction started -

Phase 1
UGP - Ground breaking

 

Phase 3
UCD - Phase 3 completed

Phase 3
Site expansion -

- Offer Package Level EMI shielding
- 12" wafer bumping capability at UAT

RBA VAP obtained ✅
Samsung Eco Partner status ✅
ANSI/ESD S20.20 certification ✅

- Expands WLCSP & Bumping capability

Phase 2 expansion -
Install wafer bump capability -

- Launched Chengdu site factory
- Commenced Wafer Bump service at UAT

Listed on Kuala Lumpur Stock Exchange Mainboard

Journey begins at Simpang Pulai, Ipoh (Malaysia)