Our Milestones

2025

Environmental & Sustainability Certifications

Goepeng Plant - Unisem Gopeng (UGP)
IECQ QC 080000:2017 HSPM Certified Silver GreenRE Certification
2024
2024

Site Launching

Goepeng Plant - Unisem Gopeng (UGP)
Phase 1
  • Complete of building construction
    • 2023
    2023

    Under Construction

    Goepeng Plant - Unisem Gopeng (UGP)
    Phase 1
  • Construction started
    • 2022
    2022

    Site Launching

    Goepeng Plant - Unisem Gopeng (UGP)
    Chengdu Plant - Unisem Chengdu (UC)
    Phase 1
  • UGP - Ground breaking

    • Phase 3
  • UC - Phase 3 completed
    • 2021
    2021

    Site Expansion

    Chengdu Plant - Unisem Chengdu (UC)
    Phase 3
  • Site expansion
    • 2019
    2019

    Advanced Packaging Capabilities

    Simpang Pulai Plant - Unisem Simpang Pulai / Unisem Advanced Technologies (USP / UAT)
  • Offer Package Level EMI shielding
  • 12" wafer bumping capability at UAT
    • 2014
    2014

    Compliance & Certifications

    Unisem (M) Berhad
    ✅ RBA VAP obtained
    ✅ Samsung Eco Partner status
    ✅ ANSI/ESD S20.20 certification
    2012
    2012

    Services Expansion

    Unisem (M) Berhad
  • Expands WLCSP & Bumping capability
    • 2011
    2011

    Site Expansion

    Chengdu Plant - Unisem Chengdu (UC)
  • Phase 2 expansion
  • Install wafer bump capability
    • 2006
    2006

    Launching Site & Services

    Chengdu Plant - Unisem Chengdu (UC)
    SImpang Pulai Plant - UAT
  • Launched Chengdu site factory
  • Commenced Wafer Bump service at UAT
    • 1998
    1998

    Stock Exchange Listing

    Unisem (M) Berhad
    Listed on Kuala Lumpur Stock Exchange Mainboard
    1992
    1992

    Humble Beginning

    Unisem (M) Berhad
    Journey begins at Simpang Pulai, Ipoh (Malaysia)

    Gold Bumping

    Reliable interconnects for wire bonding and flip-chip applications.