Contact
Global Presence, Local Support
With state-of-the-art facilities strategically located across Asia, Unisem delivers world-class semiconductor packaging and test services with the responsiveness and partnership you need.
Whether you're exploring advanced packaging solutions, specialized bumping services, or comprehensive test capabilities, our team is ready to collaborate with you.
Southeast Asia Region
Simpang Pulai Plant
Unisem Simpang Pulai
Unisem Advanced Technologies
Unisem (M) Berhad
No.1, Persiaran Pulai Jaya 9,
Kawasan Perindustrian Pulai Jaya,
31300 Ipoh,
Perak Darul Ridzuan,
Malaysia.
- +6(05) 357 2800
- [email protected]
Gopeng Plant
Unisem Gopeng
Unisem (M) Berhad
Lot. 302285, Jalan Industri 1/1,
Kawasan Perindustrian Gopeng,
31600 Gopeng,
Perak Darul Ridzuan,
Malaysia.
- +6(05) 357 2878
- [email protected]
Chengdu Plant
Unisem Chengdu
Unisem Chengdu Co., Ltd
No. 8-2, Kexin Road,
West Park of
Chengdu High-tech Zone,
Chengdu, Sichuan,
611731, P.R. China.
- +(86) 28 8795 8228
- +(86) 28 8795 1288
SINGAPORE
Marketing & Administrative Office
Unisem (S) Pte. Ltd.
37, Jalan Pemimpin,
#04-14,
Singapore,
577177
- +65(6) 158 9192
- [email protected]
KOREA
Rep. Office
P & L Co., Ltd.
#1201, Windstone B/D,
275-2 Yangjae-dong,
Seocho-Gu Seoul,
137-722, Korea
- +82(2) 3462 3660
- +82(2) 3462 3644
TAIWAN
Rep. Office
- +(886) 926 592218
- [email protected]
US Region
North. California
Rep. Office
East Coast
Rep. Office
Europe Region
United Kingdom
Rep. Office
PO Box 193
Bristol, BS20 1BQ
United Kingdom
For more information, kindly fill up the contact form, we will get back to you shortly.
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.