We have 100+
customers
world-wide
We are
Global Provider
Semiconductor Assembly
Delivering Commitment
and Excellence
Precision
Gold bumps are conductive interconnects used in semiconductors.
Sustainability
Upholding transparency, accountability, and long-term value creation.
Trusted and Reliable
Delivering trusted semiconductor assembly and test services for over 30 years worldwide.
Driving Semiconductor
Excellence
across Southeast Asia
Innovation Driven
Solution
Regional
Network
Commitment
to Excellence
Driving Semiconductor
Excellence
across Southeast Asia
Innovation
Driven
Solution
Global
Regional
Network
Commitment
Towards
Excellence
Corporate Info
Unisem is a leading global provider of Outsourced Semiconductor Assembly and Test (OSAT) services, offering comprehensive semiconductor packaging, assembly, bumping, testing and wafer processing solutions.
With operations established since 1992, Unisem serves customers worldwide across a broad range of semiconductor applications.
Unisem (M) Berhad
198901006009 (183314-V)
| Stock long name | Unisem (M) Bhd |
| Stock quote
– Reuters RIC – Bloomberg |
5005, UNISEM
UNSM.KL UNI MK |
| ISIN | MYL5005OO003 |
| Member of indices | Technology,
EMAS, Syariah, FBM70, F4GBM |
| Trading Board | Main |
| Sector | Technology |
| Total no. of issued shares | 1,613,079,110 |
Unisem (M) Berhad
198901006009 (183314-V)
| Stock long name | Unisem (M) Bhd |
| Stock quote
– Reuters RIC – Bloomberg |
5005, UNISEM
UNSM.KL UNI MK |
| ISIN | MYL5005OO003 |
| Member of indices | Technology,
EMAS, Syariah, FBM70, F4GBM |
| Trading Board | Main |
| Sector | Technology |
| Total no. of issued shares | 1,613,079,110 |
Semiconductor
OSAT Services
Global Impact
and Insights
Sustainability
OSAT Provider
Global Presence
Trusted Partnership
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.