Unisem Advanced Technology (UAT)
Unisem Group Subsidaries (since 2006)
Unisem Advanced Technologies (UAT) Sdn Bhd formerly known as Unisem-Advanpack Technologies Sdn Bhd is a leading provider of wafer bumping and advanced interconnect solutions. As one of Malaysia’s first independent specialists in this field, we have been setting industry benchmarks since 2006.
Operating from a 1,418-square-meter facility, UAT maintains Class 100 (1,248 -square meter), 1,000, and 10,000 cleanroom environments, enabling exceptional process control and contamination-free manufacturing
With the capability to process wafers up to 300mm, we offer a full suite of wafer bumping services engineered for precision, reliability, and high performance — Supporting a wide range of semiconductor applications across global markets.
Comprehensive Wafer Bumping
& Redistribution Services
UAT provides industry-leading bumping and wafer-level processing for 150mm, 200mm and 300mm wafers, with cleanroom classifications of Class 100, 1,000, and 10,000. Our capabilities as following.
Electroplated Solder Bumping
Gold Bumping
Electroplated Copper Pillar Bumping
Large Solder Bumping (Ball Drop)
Quality Management System
Unisem’s management system is in compliance to the international and local standards on Quality Management Systems and Environmental Management Systems which are vital to our business globally. Each of Unisem sites is proud to have achieved the third party certification to these standards.