Package

Offerings

From Leadframe to Wafer Level
A Full Spectrum of Packaging Solutions

Our exclusive services

Laminate
Packages

  • FBGA / LGA
  • MCM / SIP
  • Stacked Die BGA

Leaded
Packages

  • PDIP
  • QSOP
  • SOIC
  • SSOP
  • TSOT
  • TSSOP

Leadless
Packages

  • SLP
  • SLP SIP
  • Stacked Die SLP
  • MIS Package
  • Prototype
  • Website & Mobile App

MEMs
Packaging

  • LGA-FLP Package Outline
  • LGA-MCP Package Outline
  • LGA-MLP Package Outline

Wafer Level
Packaging

  • WLCSP

Versatile Packaging Options

Tailored for Performance

Delivering Proven, Scalable, and Next-Gen Semiconductor Packaging Technologies

Shaping the
Future of Technology