Wafer & Dice Sales
Processing Services
Performance, and production readiness
at every stage of the wafer journey
Unisem supports the increasing demand for wafer-level solutions, particularly for advanced packages that are not assembled in-house.
Our Wafer & Dice Sales Processing Services are engineered to meet the stringent quality and reliability standards of the semiconductor and automotive industries We offer a complete range of backend wafer processing services, including:
This turnkey solution enables our customers to receive fully processed, high-quality diced wafers, ready for downstream integration or direct shipment to their end customers—supporting applications across ADAS, EV power modules, industrial sensors, and consumer electronics.
Our Exclusive Services
This turnkey solution enables our customers to receive fully processed, high-quality diced wafers, ready for downstream integration or direct shipment to their end customers—supporting applications across ADAS, EV power modules, industrial sensors, and consumer electronics.
Wafer
Backgrind
Wafer
Mounting
Dicing
Laser
Grooving
Automated Optical Inspection (AOI)
Packing into
Shipper Boats
Key Benefits
With Unisem, you gain a trusted partner committed to delivering precision, performance, and production readiness at every stage of the wafer journey.
Optimized for high-reliability applications
Automotive-grade process controls and traceability
Streamlined supply chain with reduced lead time
Scalable support from NPI to high-volume production
Premium Wafer Supply
Precision Dice Processing
Accelerate your production with Unisem's wafer sales and dice processing services
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.