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Overview
About
Our Management
Our Milestones
Awards & Achievements
Operation Sites
Unisem Simpang Pulai (USP) – HQ
Unisem Gopeng Plant (UGP)
Unisem Chengdu (UCD)
Unisem Advanced Technology (UAT)
Quality Assurance
Services
Package Offerings
Bumping Services
Test Services
Wafer Sales
Career
Job Opportunities
Training & Developments
Contact
Home
Overview
About
Our Management
Our Milestones
Awards & Achievements
Operation Sites
Unisem Simpang Pulai (USP) – HQ
Unisem Gopeng Plant (UGP)
Unisem Chengdu (UCD)
Unisem Advanced Technology (UAT)
Quality Assurance
Services
Package Offerings
Bumping Services
Test Services
Wafer Sales
Career
Job Opportunities
Training & Developments
Contact
Wafer Sales
&
Dice Processing
Services
Performance, and production readiness
at every stage of the wafer journey
Our exclusive services
Wafer Backgrind
Mounting
Laser Grooving
Dicing
Automated Optical Inspection (AOI)
Packing into Shipper Boats
Premium
Wafer
Supply
Precision Dice Processing
Accelerate your production with Unisem's wafer sales and dice processing services
Shaping the
Future of Technology