Unisem Gopeng
Your Next-Gen Semiconductor Powerhouse
Welcome to Unisem Gopeng, our cutting-edge flagship facility engineered to accelerate your success in the ever-evolving electronics landscape. Purpose-built with the latest in automation and precision technologies, we’re raising the bar for quality, speed and innovation.
At Unisem Gopeng, innovation meets reliability. Partner with us to unlock new levels of speed, scale and sophistication in semiconductor packaging—and power the next wave of electronic breakthroughs.
Competitive Production Services
At Unisem Gopeng, innovation meets reliability. Partner with us to unlock new levels of speed, scale and sophistication in semiconductor packaging and power the next wave of electronic breakthroughs.
World Class Infrastructure
Modular Packaging Expertise
Building on our proven QFN/MIS capabilities, Gopeng is a dedicated hub for Module and System-in-Package (SiP) solutions, with MEMS integration on the horizon. Whether you need high-density I/O, mixed-signal interconnects or next-generation sensor fusion, our lines adapt to your roadmap.
Strategic Global Gateway
Nestled within a mature semiconductor supply-chain ecosystem and equipped with on-site warehousing and drop-shipment services, Unisem Gopeng delivers seamless logistics from prototype to production and around the world.
Unwavering Commitment to Excellence
Backed by a handpicked team of process engineers and quality specialists, we combine rigorous in-line testing with ISO grade quality controls to ensure every device surpasses your toughest performance criteria.
Quality Management System
Unisem’s management system is in compliance to the international and local standards on Quality Management Systems and Environmental Management Systems which are vital to our business globally. Each of Unisem sites is proud to have achieved the third party certification to these standards.
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.