Corporate Structure
UNISEM (M) BERHAD
100%
Unisem
(Sunnyvale),
Inc.,
United States of America
100%
Unisem
Chengdu
Co., Ltd.,
Chengdu, China
100%
Unisem
Advanced
Technologies
Sdn. Bhd.,
Simpang Pulai, Malaysia
100%
Unisem (S)
Pte. Ltd.,
Singapore
Unisem Chengdu Co., Ltd.,
Chengdu, China
- Principal activities: Packaging and testing of semiconductor devices
- 100% owned by UM
Unisem Advanced Technologies Sdn. Bhd.,
Simpang Pulai, Malaysia
- Principal activities: Wafer bumping services
- 100% owned by UM
Unisem (Sunnyvale), Inc.,
United States of America
- Principal activities: Marketing and other support services
- 100% owned by UM
Unisem (S) Pte. Ltd.,
Singapore
- Principal activities: Marketing, administrative and other support services
- 100% owned by UM
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.