Unisem Simpang Pulai
Driving Innovation. Delivering Scale.
Established in 1992, Unisem Simpang Pulai (USP) is the cornerstone of Unisem Group’s operations in Malaysia – home to over 2,900 skilled employees and spanning 570,000 square feet of built-up manufacturing space. This flagship facility delivers full turnkey assembly and test services to some of the world’s most innovative semiconductor companies.
USP offers a comprehensive suite of back-end semiconductor solutions, from wafer bump to final test – all under one roof. Our capabilities as shown following.
Fully Integrated, Future-Ready
Our integrated approach simplifies the supply chain, improves turnaround time, and ensures top-tier quality and performance across a wide range of applications.
Wafer
Services
- Gold Bump
- Ball Drop
- Plated Solder Bump
- Copper Pillar Bump
Advanced
Packaging
- Package Development
- Assembly Packaging
Final Test
Services
- Final Electrical Testing
- Reliability Testing
- Failure Analysis
Certified for Excellence
USP operates to the highest global standards—ensuring quality, safety, environmental responsibility, and ethical operations at every level. Key certifications include:
- IATF 16949:2016 – Automotive Quality Management
- ISO 9001, 14001, 45001 – Quality, Environmental, Occupational Health & Safety
- ANSI/ESD S20.20 – ESD Control
- RBA VAP – Social and Ethical Compliance
- Certified Samsung Eco-Partner & Sony Green Partner
Quality Management System
Unisem’s management system is in compliance to the international and local standards on Quality Management Systems and Environmental Management Systems which are vital to our business globally. Each of Unisem sites is proud to have achieved the third party certification to these standards.
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.