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Overview
About
Corporate Info
Corporate Governance
Corporate Social Responsibility
Corporate Structure
Our Management
Our Milestones
Awards & Achievements
Operation Sites
Simpang Pulai Plant
Unisem Simpang Pulai
Unisem Advanced Technologies
Unisem Gopeng
Unisem Chengdu
Quality Reliability & Assurance
Services
Package Offerings
Bumping Services
Test Services
Wafer Sales
Career
Job Opportunities
Job Openings
Training & Developments
Investor
Contact
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Reliable interconnects for wire bonding and flip-chip applications.
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