Unisem Advanced Technologies (UAT)
Precision Bumping. Advanced Integration. Scalable Solutions
Unisem Advanced Technologies Sdn Bhd (UAT), formerly known as Unisem-Advanpack Technologies Sdn Bhd, is a pioneer in wafer bumping services and one of Malaysia’s first independent providers of advanced interconnect solutions.
Established in 2006, UAT delivers advanced wafer-level bumping solutions for a wide range of semiconductor applications.
Its 37,000-square-foot facility features Class 100, Class 1,000, and Class 10,000 cleanroom environments, including a dedicated Class 1K cleanroom, ensuring stringent process control and contamination-free manufacturing.
With capabilities supporting wafers up to 200mm, UAT provides comprehensive bumping solutions with the precision, quality, and reliability required for high-performance semiconductor devices.
Comprehensive Wafer Bumping
& Redistribution Services
UAT provides industry-leading bumping and wafer-level processing for 150mm, 200mm and 300mm wafers, with cleanroom classifications of Class 100, 1,000, and 10,000. Our capabilities as following.
- Gold Bumping – High-reliability interconnects for wire bonding and flip-chip applications
- Electroplated Solder Bumping – Lead-free and eutectic solder solutions
- Electroplated Copper Pillar Bumping – High-density, high-performance interconnects
- Large Solder Bumping (Ball Drop) – Optimal for advanced package-on-package (PoP) and BGA applications
- Passivation & Redistribution – Polyimide (PI), PBO, BCB passivation, and bond pad redistribution
- In-House Photomask & Stencil Design – Shorter lead times and greater process control
Large Solder Bumping
(Ball Drop)
Electroplated
Copper Pillar
Bumping
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.
Electroplated
Solder Bumping
Lead-free and eutectic solder solutions tailored to diverse requirements.
Certified for Excellence
- IATF 16949:2016 – Automotive Quality
- ISO 9001:2015, ISO 14001:2015, ISO 45001:2018
- ANSI/ESD S20.20-2014 – Electrostatic Discharge Protection
- RBA VAP – Responsible Business Alliance Compliance
- Samsung Eco-Partner & Sony Green Partner
With a legacy of technical excellence and innovation, UAT continues to push the boundaries of advanced wafer-level packaging—delivering scalable, high-performance interconnect solutions for the next generation of semiconductor devices.
Quality Management System
Unisem’s management system is in compliance to the international and local standards on Quality Management Systems and Environmental Management Systems which are vital to our business globally. Each of Unisem sites is proud to have achieved the third party certification to these standards.
Gold Bumping
Reliable interconnects for wire bonding and flip-chip applications.