Test Services

Wide Range Capabilities for Electrical Test
Ensuring Excellence at the Final Gate
At Unisem, we offer comprehensive Final Test solutions that ensure every semiconductor device performs flawlessly before reaching the market. Our services include RF and mixed-signal testing, Tape & Reel, and direct-to-customer shipments, all executed with precision and efficiency.

Our dedicated 63,000 sq. ft. test facility in Ipoh, Malaysia serves as a global hub for advanced probe, test, and engineering services — supporting leading semiconductor innovators across industries.

Our Exclusive Services

As your full turnkey partner, Unisem transforms test operations from a potential bottleneck into a competitive advantage.

Our test engineering expertise spans hardware, software, and process optimization, enabling you to focus on innovation while we ensure your devices are market-ready.

Tester Platforms

  • AccoTest
  • Advantest
  • Cohu
  • Chang Chuan
  • Teradyne
  • Rack & Stack

Wafer Probe

  • Electroglass
  • KLA
  • TSK
  • TEL
  • Chang Chuan

Handler List

  • ASM
  • SRM
  • Multitest
  • Rasco
  • Seiko Epson
  • Ismeca
  • Chang Chuan

Vision Check

  • Micro-Vision
  • Visdynamic
  • STI (S)
  • SRM
  • Vitrox

Industries & Applications We Support

We serve a broad range of markets that demand absolute reliability and high performance, including:

Artificial
Intelligence (AI)

High-Performance Computing (HPC)

Internet of
Things (IoT)

Power
Management

Automotive

Core Capabilities

  • High-Throughput Testing
    Accelerated test cycle times to boost production efficiency
  • Multi-Site Parallel Testing
    Test multiple units simultaneously for greater output per run
  • Advanced Defect Detection
    Leverage precision diagnostics to catch even the smallest anomalies
  • Scalable & Customizable Test Solutions
    Adapt to volume changes and evolving product requirements
  • Global Standards Compliance
    Fully aligned with JEDEC, AEC-Q100, and other industry benchmarks

Why Final Test Matters

The Final Test stage is the last quality gate in the semiconductor production cycle

This critical phase guarantees that only reliable, fully tested devices leave the line.

Gold Bumping

Reliable interconnects for wire bonding and flip-chip applications.