Overview
About
Corporate Info
Corporate Governance
Corporate Social Responsibility
Corporate Structure
Our Management
Our Milestones
Awards & Achievements
Operation Sites
Simpang Pulai Plant
Unisem Simpang Pulai
Unisem Advanced Technologies
Unisem Gopeng
Unisem Chengdu
Quality Reliability & Assurance
Services
Package Offerings
Bumping Services
Test Services
Wafer Sales
Career
Job Opportunities
Job Openings
Training & Developments
Investor
Contact
Overview
About
Corporate Info
Corporate Governance
Corporate Social Responsibility
Corporate Structure
Our Management
Our Milestones
Awards & Achievements
Operation Sites
Simpang Pulai Plant
Unisem Simpang Pulai
Unisem Advanced Technologies
Unisem Gopeng
Unisem Chengdu
Quality Reliability & Assurance
Services
Package Offerings
Bumping Services
Test Services
Wafer Sales
Career
Job Opportunities
Job Openings
Training & Developments
Investor
Contact
Our Management
Board of Directors
JOHN CHIA SIN TET
Chairman / Group Managing Director
Malaysian, Male
FRANCIS
CHIA MONG TET
FRANCIS CHIA MONG TET
Executive Director
Malaysian, Male
ALEXANDER
CHIA JHET-WERN
ALEXANDER CHIA JHET-WERN
Executive Director
Malaysian, Male
NELLEITA BINTI OMAR
Independent Director
Malaysian, Female
TEH MUY CH’NG
Independent Director
Malaysian, Female
NOOR ALINA BINTI
MOHAMAD FAIZ
Independent Director
Malaysian, Female
PATRICK
NG GAN HOOI
Independent Director
Malaysian, Male
XIAO ZHIYI
Non-Executive Director
Malaysian, Male
CUI WEIBING
Non-Executive Director
Malaysian, Male
CHANG WENYING
Non-Executive Director
Malaysian, Male
CHEN YAN
Non-Executive Director
Malaysian, Female
Team Management
KEVIN KHOO CHUNG SHIN
Group Chief Operating Officer
LEE JEE KHEONG
Chief Operating Officer
Unisem (M) Berhad, Malaysia
QUEK SUAN HONG
Chief Operating Officer
Unisem Chengdu, China
WONG KWAI HONG
Chief Technology Officer
WONG WAI LING
Vice President, Group Finance
Gold
Bumping
Reliable interconnects for wire bonding and flip-chip applications.
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